首页|Polishing mechanism of single-crystal silicon in fixed-abrasive chemical mechanical polishing with different solutions

Polishing mechanism of single-crystal silicon in fixed-abrasive chemical mechanical polishing with different solutions

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Chemical mechanical polishing (CMP) is a widely used polishing technique for Si wafers, but cost and environmental concerns have always been open questions. This study proposed a novel fixed-abrasive CMP (FACMP) using environmentally friendly salt solutions to improve polishing efficiency while reducing polishing costs. The surface modification of the Si surface in three kinds of salt solutions, i.e., ultrapure water, NaCl and Na_2CO_3 aqueous solutions, was investigated via three modification experiments and molecular dynamics (MD) simulations. Surface modification, mainly oxidation of the Si surface, occurred in these three liquids. Na_2CO_3 aqueous solution was found to be an effective liquid for modifying the Si surface, in which the highest modification rate was obtained. Etching of the Si surface occurred in the Na_2CO_3 aqueous solution, and CO_3~(2-) ions were involved in the modification and etching of the Si surface; an etching rate of 0.14 μm/h was observed. In addition, FACMP of 4-inch Si wafers was conducted in these three liquids, and the highest material removal rate of 4.252 μm/h was obtained in the Na_2CO_3 aqueous solution. This study provides a possible way to realize a low-cost, high-efficiency, and environmentally friendly polishing method for Si wafers and even other semiconductor materials.

Si waferFixed-abrasive CMPSurface modificationMolecular dynamics simulation

Xiaozhe Yang、Shenglong Zhang、Fangming Lian、Xu Yang、Kazuya Yamamura、Zhuangde Jiang

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Institute of Precision Engineering, School of Mechanical Engineering, Xi'an Jiaotong University, No. 28, West Xianning Road, Xi'an, Shaanxi 710049, China

Institute of Precision Engineering, School of Mechanical Engineering, Xi'an Jiaotong University, No. 28, West Xianning Road, Xi'an, Shaanxi 710049, China||The State Key Laboratory for Manufacturing Systems Engineering, No. 99 Yan Cheung Road, Xi'an, Shaanxi 710054, China

Research Center for Precision Engineering, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan

2025

Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials
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