首页|Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment
Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment
扫码查看
点击上方二维码区域，可以放大扫码查看
原文链接
NETL
NSTL
Elsevier
As a basic component, multilayer ceramic capacitors (MLCCs) have been widely used in many engineering fields. Failure caused by printed circuit board flex deserves special attention throughout the entire lifecycle of MLCCs. In this failure pattern, the failure probabilities vary across different types of MLCCs. The initial damage location and the direction of cracking propagation display distinct characteristics. This paper presents the MLCC equivalent model by using homogenization theory in finite element method (FEM), and simulates the flex failure of different types of MLCCs. Three-point bending experiments are conducted to validate the FEM results, revealing the underlying cause of flex cracking. The failure pattern inferred by FEM aligns well with the experiment result, with the maximum error of only 7.56 %, demonstrating the equivalent model's effectiveness. Furthermore, we conduct a sensitivity analysis of geometric parameters, including the length-width ratio, terminal electrode width, stacking height, and solder joint height. Our study reveals the underlying mechanism of MLCC flex failure and identifies the key design factors influencing MLCC reliability. These findings provide valuable insights into the design, application, and enhancement of MLCC reliability.
NETL
NSTL
Elsevier
