首页|All-Rounder: A Flexible AI Accelerator With Diverse Data Format Support and Morphable Structure for Multi-DNN Processing

All-Rounder: A Flexible AI Accelerator With Diverse Data Format Support and Morphable Structure for Multi-DNN Processing

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Recognizing the explosive increase in the use of artificial intelligence (AI)-based applications, several industrial companies developed custom application-specific integrated circuits (ASICs) (e.g., Google TPU, IBM RaPiD, and Intel NNP-I/NNP-T) and constructed a hyperscale cloud infrastructure with them. These ASICs perform operations of the inference or training process of AI models which are requested by users. Since the AI models have different data formats and types of operations, the ASICs need to support diverse data formats and various operation shapes. However, the previous ASIC solutions do not or less fulfill these requirements. To overcome these limitations, we first present an area-efficient multiplier, named all-in-one multiplier, which supports multiple bit-widths for both integer (INT) and floating-point (FP) data types. Then, we build a multiply-and-accumulation (MAC) array equipped with these multipliers with multiformat support. In addition, the MAC array can be partitioned into multiple blocks that can be flexibly fused to support various deep neural network (DNN) operation types. We evaluate the practical effectiveness of the proposed MAC array by making an accelerator out of it, named All-rounder. According to our evaluation, the proposed all-in-one multiplier occupies $1.49\times $ smaller area compared to the baselines with dedicated multipliers for each data format. Then, we compare the performance and energy efficiency of the proposed All-rounder with three different accelerators showing consistent speedup and higher efficiency across various AI benchmarks from vision to large language model (LLM)-based language tasks.

Artificial intelligenceConvolutionTrainingArtificial neural networksArraysData modelsComputational modelingInternetAI acceleratorsElectronic mail

Seock-Hwan Noh、Seungpyo Lee、Banseok Shin、Sehun Park、Yongjoo Jang、Jaeha Kung

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Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, South Korea

DGIST, Daegu, South Korea|Fitogether, Seoul, South Korea

DGIST, Daegu, South Korea|Samsung Electronics, Suwon, South Korea

School of Electrical Engineering, Korea University, Seoul, South Korea

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2025

IEEE transactions on very large scale integration (VLSI) systems
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