首页|A dual heterogeneous laminated microstructure design for improving the mechanical properties and electrical conductivity of copper alloys
A dual heterogeneous laminated microstructure design for improving the mechanical properties and electrical conductivity of copper alloys
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NSTL
Elsevier
? 2022 Elsevier Inc.Achieving an excellent combination of mechanical properties and electrical conductivity in conductive copper alloys is highly desirable but remains a great challenge. This paper reports a dual heterogeneous laminated (DHLed) Cu/Cu-Cr-Zr composite structure in copper alloys produced by accumulative roll bonding (ARB) and annealing process that can produce an excellent property combination: high strength (ultimate tensile strength: 563.4 ± 14 MPa), sufficient tensile ductility (uniform elongation: ~16.2%), and high conductivity (~92%IACS). The specially designed DHLed Cu/Cu-Cr-Zr composite microstructure is characterized by alternating coarse- and ultra-fine grain layers and layered distribution of precipitations. Such dramatic microstructure heterogeneities produce significant hetero-deformation induced hardening due to mechanical incompatibility between soft Cu and hard Cu-Cr-Zr layers, which leads to an excellent combination of strength and ductility. The high conductivity can be attributed to the unique DHLed Cu/Cu-Cr-Zr composite structure containing alternating recrystallized- and nanolaminated-grain layers.
Accumulative roll bondingDual heterogeneous structureHetero-deformation-induced hardeningLaminated composite
You C.、Zeng L.、Zhang X.、Wang H.、Gao R.
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Faculty of Materials Metallurgy and Chemistry Jiangxi University of Science and Technology
Department of Nuclear Science and Technology Xi'an Jiaotong University
NSTL
Elsevier
