首页|Influence of Thermal Processing Conditions on Mechanical and Material Properties of 3D Printed Thin-Structures Using PEEK Material
Influence of Thermal Processing Conditions on Mechanical and Material Properties of 3D Printed Thin-Structures Using PEEK Material
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NSTL
Korean Soc Precision Eng
Poly-ether-ether-ketone (PEEK) was one of the most promising engineering plastics, which had been widely employed in the aerospace, biomedical and automotive industry and manufacturing. The design of various 3D printing (3DP) parameters had a significant impact on its mechanical and thermal properties. This study aimed to investigate the thermodynamic properties of thin-structure PEEK samples by printing them under various conditions, including varying substrate and ambient temperature parameters, under a control- method. Numerous critical properties such as interlayer bonding force, tensile and bending properties, dynamic mechanical properties, and crystallization had been investigated in this work. The results indicated that the maximum relative interlayer bonding force was 989.91 N, while comparing to the lowest initial ambient and substrate temperature 60 degrees C and 90 degrees C, the optimal tensile and bending strengths both increased by 28.46% and 13.86% to 86.62 MPa and 113.21 MPa under ambient and substrate temperature 90 degrees C and 160 degrees C, respectively. Concurrently, the crystallinity increased by 6.67% to 31.56%. Mechanical and thermal properties had been significantly improved when appropriate substrate temperature parameters were used during the printing process, demonstrating the enormous potential in printing PEEK material. Thermal processing was another critical factor in achieving higher performance of 3D printing PEEK components.
NSTL
Korean Soc Precision Eng
