首页|Convenient, nondestructive monitoring and sustained-release of ethephon/chitosan film for on-demand of fruit ripening

Convenient, nondestructive monitoring and sustained-release of ethephon/chitosan film for on-demand of fruit ripening

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? 2022 Elsevier B。V。The microstructure changes (such as micro defects and free volume, etc。) is a deep factor that determines the sustained release behavior of polymer film。 However, there are few reports exploring the micro defects of sustained-release materials。 Herein, we develop a facile method to non-destructive monitoring and sustained-release ethylene within chitosan。 The comprehensive means of positron annihilation lifetime spectroscopy, atomic force microscopy and Raman spectrums are performed together to study the microstructures change of ethylene sustained-release and its mechanism。 When ethylene is in chitosan film, it shows good ripening performance and mechanical properties。 The sustained-release ethylene improves its bioavailability and can control the fruit-ripening on-demand。 More importantly, the microstructural changes of cavities have a significant impact on the sustained release of ethylene, due to the creation of cavities, the free volume of positrons undergoes a process of increasing from less to more and then gradually decreasing, reaching a maximum at 120 h。 Furthermore, the ethephon/chitosan film could on-demand control the ripening time of mangoes and bananas。 Therefore, this research presents a comprehensive means to study of microstructure change monitoring and controllable sustained release, and provides the possibility to solve the problem of on-demand ripening of fruit and reducing pesticide residue。

Non-destructive monitoringOn-demand ripeningPositron annihilation lifetime spectroscopy

Xu C.、Lin B.、Yao Y.、Deng Y.、Liang Y.、Li X.、Tang X.、Lin M.、Fu L.

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School of Chemistry and Chemical Engineering Guangxi University

2022

International Journal of Biological Macromolecules

International Journal of Biological Macromolecules

EIISTP
ISSN:0141-8130
年,卷(期):2022.214
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