Abstract
In the current paper, we present the influence of adding high thermal conductivity materials on the thermal management performance of low-melting-point alloys in different aspects. We analyze the phase change process of 47 alloy and n-tricosane before and after compounding with copper foam based on numerical simulation. Moreover, we calculate the temperature management curve of low-melting-point alloy composite materials with different foam porosity. Our results indicate that the addition of copper foam significantly improves the thermal management performance of n-tricosane. Due to the difference in latent heat, the thermal management time of copper foam/47 alloy is 1.21 times higher than the former. The addition of copper foam mainly improves its thermal response and inhibits the temperature rise in the phase transition stage. Just 5% of copper foam has a significant effect. For copper foam/47 alloy, the higher the porosity, the stronger the temperature management ability. This feature is more prominent when the upper limit is the temperature below the melting point.