首页|Study on the evolution of interfacial (Cu,Ni)(6)Sn- 5 and shear property of (111)Cu/Sn/Ni micro joints under isothermal and TG-bonding
Study on the evolution of interfacial (Cu,Ni)(6)Sn- 5 and shear property of (111)Cu/Sn/Ni micro joints under isothermal and TG-bonding
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NSTL
Elsevier
Single-crystal Cu can be potentially applied as pad or micro bump in bonding technology for advanced packaging. A novel bonding method with an extra temperature gradient (TG, TG-bonding) was carried out to bonding single-crystal (111)Cu and poly-crystal Ni substrates with Sn as interlayer. The morphology and orientation evolution, elemental distribution and growth kinetics of interfacial (Cu,Ni)6Sn5 intermetallic compound (IMC) in (111)Cu/Sn/Ni micro joints during isothermal and TG-bonding were investigated. Regular roof-type (Cu,Ni)6Sn5 grains along three intersectant directions with an angle of 60 degrees formed at the initial Sn/(111)Cu interface and maintained the roof-type morphology with (1120) preferred orientation throughout the isothermal bonding. For TG-bonding, TG-induced atomic thermomigration (TM) and Cu-Ni cross-interaction co-played a critical role in the morphology, grain feature and growth kinetics of the interfacial IMCs. Moreover, rapid growth of (Cu,Ni)6Sn5 phase was achieved by TG-bonding with (111)Cu as hot end to fabricate full IMC joints which had higher shear strength than the cases of isothermal and TG-bonding with (111)Cu as cold end. The proposed method would provide a further insight for developing bonding technology for advanced packaging.
NSTL
Elsevier
