首页|Thermal contact conductance across filled polyimide films at cryogenic temperatures
Thermal contact conductance across filled polyimide films at cryogenic temperatures
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NSTL
Thermal contact resistance arises in the region ofcontact where two solid specimens are pressed together. Thethermal resistance can be controlled by inserting an interstitialmaterial at the interface, such as Kapton MT, a polyimide filmcontaining alumina particles, which has a relatively low thermalresistance, but yet a high voltage standoff capability. The thermalresistance consists of two components: thermal contact resistanceat the copper/Kapton MT interfaces, and the thermal conductionresistance across the Kapton MT film. The measured thermalresistance at low temperatures indicates that increasing the contactpressure reduces the thermal resistance, to a limit determined bythe film conduction resistance. The effects of the contact pressure,the average interface temperature and the thickness of theinterstitial layer are evaluated. A novel dimensionless correlationis derived from the experimental results that describes the thermalcontact conductance of joints which include a soft interstitialmaterial, at cryogenic temperatures.
NSTL
