Journal of Alloys and Compounds2022,Vol.90710.DOI:10.1016/j.jallcom.2022.164531

Vacant defect and nitrogen doping effects on the interface of graphene/Cu composites: Computational and experimental evaluation

Liu L. Bao R. Zhao W. Liu P. Yi J. Ge Z. Ling S.
Journal of Alloys and Compounds2022,Vol.90710.DOI:10.1016/j.jallcom.2022.164531

Vacant defect and nitrogen doping effects on the interface of graphene/Cu composites: Computational and experimental evaluation

Liu L. 1Bao R. 1Zhao W. 1Liu P. 1Yi J. 1Ge Z. 1Ling S.2
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作者信息

  • 1. Faculty of Materials Science and Engineering Kunming University of Science and Technology
  • 2. Advanced Materials Research Group Faculty of Engineering University of Nottingham
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Abstract

? 2022 Elsevier B.V.To explore an efficient way of modifying carbon nanomaterials to improve the interfacial bonding with the Cu matrix, the interaction between Cu and pristine graphene, single- and double-vacant defect graphene, and nitrogen-doped graphene was systematically investigated by density functional theory (DFT) calculations. The electronic structure, including Bader charge and charge density differences, reveals that the existence of vacancies and nitrogen doping are beneficial for the transfer of electrons at the interface, mainly due to the enhanced binding energy and their intense interaction with Cu atomic orbitals. Pyridine-N and pyrrole-N are more capable of coupling with the interfacial Cu atoms, suggests a vital role of nitrogen doping in the improvement of the mechanical and electrical properties of graphene/Cu composites. To validate our computational prediction, heat-treated carbon polymer dot (CPD), which can be regarded as nitrogen-rich graphene, were employed to prepare bulk CPD/Cu composites. The mechanical performance was significantly better than that of the pure Cu matrix, proves that nitrogen doping could effectively improve C/Cu interface bonding. This research provided a theoretical and experimental basis for the preparation of advanced Cu matrix composites.

Key words

Cu composites/Graphene/Interfacial bonding/Nitrogen doping/Vacancy

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量9
参考文献量34
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