首页|Diffusion bonding and interface structure of advanced carbide-dispersion-strengthened Cu and oxide-dispersion-strengthened W
Diffusion bonding and interface structure of advanced carbide-dispersion-strengthened Cu and oxide-dispersion-strengthened W
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NSTL
Elsevier
Metallurgical bonding was achieved between carbide-dispersion-strengthened Cu (CDS-Cu) and oxide dispersion-strengthened W (ODS-W) after diffusion bonding via an interface tailoring method of anodization and deoxidation of ODS-W combined with the introduction of Cu wetting layer. The shear strength of the CDSCu/ODS-W joints fabricated by the interface-tailoring bonding is 124 MPa, which is higher than that of 99 MPa of the joint prepared by direct bonding. The increase in strength is due to the achievement of the metallurgical bonding between CDS-Cu/ODS-W, the increase of the debonding energy and the increase of propagation distance of the cracks. After metallurgical bonding, the second phase particles of WC in CDS-Cu and Y2O3 in ODS-W were dispersed at the phase boundary to reduce the lattice strain energy. This work paves the way for the preparation of advanced plasma-facing components comprised of high-performance CDS-Cu and ODS-W for China Fusion Engineering Test Reactor (CFETR).
NSTL
Elsevier
