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Cu-induced enhancement of interfacial bonding for brazed diamond grits with Ni-Cr filler alloys
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NSTL
Elsevier
Restraining diamond graphitization is still the potential problem for brazed diamond tools with Ni-Cr filler alloys. Herein, we systematically investigate the interfacial bonding and mechanical performance of brazed diamond tools with Cu-doping Ni-Cr filler alloys through multi-scale atomistic simulations and experiments. First-principles calculations show that the Cu-doping not only inhibits the structural damage of diamond, but also enhances the metallurgical bonding between diamond and filler alloys. The tensile simulations of Ni-Cr-Cu/ diamond interface further verify the strengthening effects of Cu-doping since these bonds of C-C within diamond and Ni-Cr-C at interface can withstand greater tensile strains. Combined with molecular dynamics simulations, Cu-doping effectively weaken the graphitization of diamond, which is confirmed through experimental Raman spectroscopy detection. More importantly, the brazed diamond tools by Ni-Cr filler doped with 40 wt% Cu alloy exhibit excellent mechanical grinding performance. These results shed a new light on improving the mechanical properties of brazed diamond tools.
NSTL
Elsevier
