Journal of Alloys and Compounds2022,Vol.9057.DOI:10.1016/j.jallcom.2022.164260

Structural relaxation in metastable magnetic submicronic wires

Lupu N. Corodeanu S. Hlenschi C. Rotarescu C. Ovari T.-A. Chiriac H.
Journal of Alloys and Compounds2022,Vol.9057.DOI:10.1016/j.jallcom.2022.164260

Structural relaxation in metastable magnetic submicronic wires

Lupu N. 1Corodeanu S. 1Hlenschi C. 1Rotarescu C. 1Ovari T.-A. 1Chiriac H.1
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作者信息

  • 1. National Institute of Research and Development for Technical Physics
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Abstract

? 2022 Elsevier B.V.Changes triggered by low temperature metastable relaxation annealing in the peculiar magnetic behavior of rapidly solidified submicronic amorphous wires are reported. The overall aim was to understand the effects of the associated stress relief process on magnetization switching and magnetic domain wall propagation in these low dimensional amorphous wires with cylindrical symmetry. The results have shown that, even though the employed relatively low annealing temperatures did not initiate any crystallization, i.e., the amorphous state has been preserved, the consequences in terms of magnetic behavior are significant, with important variations in both magnetic switching field and domain wall velocity values. The observed modifications have been interpreted based on the interplay between the magnetoelastic and magnetostatic anisotropies within the submicronic amorphous wires, as well as on the complex changes in the underlying nonlinear stress distribution generated by the rapid solidification process. The outcomes of this investigation, alongside the general framework for their explanation, have unraveled novel ways of accurately tailoring and controlling the magnetic characteristics of the amorphous submicronic wires for developing new applications in sensors and domain wall logic devices, in which rapid switching and fast domain walls can make an important impact.

Key words

Anisotropy/Composite materials/Magnetic measurements/Magnetostriction/Metallic glasses/Quenching/Rapid solidification

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量1
参考文献量11
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