Journal of Alloys and Compounds2022,Vol.8929.DOI:10.1016/j.jallcom.2021.162176

Visible light-induced degradation of amoxicillin antibiotic by novel CuI/FePO4 p-n heterojunction photocatalyst and photodegradation mechanism

Beshkar F. Salavati-Niasari M. Al-Nayili A. Amiri O. Mousavi-Kamazani M.
Journal of Alloys and Compounds2022,Vol.8929.DOI:10.1016/j.jallcom.2021.162176

Visible light-induced degradation of amoxicillin antibiotic by novel CuI/FePO4 p-n heterojunction photocatalyst and photodegradation mechanism

Beshkar F. 1Salavati-Niasari M. 1Al-Nayili A. 2Amiri O. 3Mousavi-Kamazani M.4
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作者信息

  • 1. Institute of Nano Science and Nano Technology University of Kashan
  • 2. Department of Chemistry College of Education University of Al-Qadisiyah
  • 3. Department of Chemistry College of Science University of Raparin
  • 4. New Technology Faculty Semnan University
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Abstract

Antibiotic pollutant as a toxic wastewater is a critical global issue for human and ecosystems. In this work, we introduce a high-performance CuI/FePO4 heterojunction nanocomposite for the elimination of amoxicillin antibiotic under simulated sunlight radiation. The hybrid CuI/FePO4 nanoparticles exhibited an energy gap of 3.03 eV and photodegradation efficiency of 90%, which were better than those of CuI and FePO4 nanostructures. The prominent photocatalytic removal activity of the CuI/FePO4 heterostructures depends on the ultrafine particles, elevated visible-light absorption, and impressive separation and negligible recombination rate of electron-hole pairs due to the generation of p-n heterojunctions. We also presented a photocatalytic degradation pathway utilizing radical quenching analysis, which is based on fundamental function of the ?OH and ?O2? radicals in the photocatalytic elimination of amoxicillin by CuI/FePO4 nanocomposite. These functional properties of the CuI/FePO4 can be beneficial for the development of future photocatalyst materials.

Key words

Amoxicillin/Radical quenching/CuI/FePO4/Heterojunction/Photocatalytic degradation

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量21
参考文献量53
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