首页|Decreased order-disorder transition temperature and enhanced phonon scattering in Ag-alloyed Cu3SbSe3

Decreased order-disorder transition temperature and enhanced phonon scattering in Ag-alloyed Cu3SbSe3

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? 2022 Elsevier B.V.Cu3SbSe3 is a promising thermoelectric material with ultralow lattice thermal conductivity, especially at temperatures above 450 K at which the order-disorder transition of copper ions takes place. To investigate whether the high-temperature disordered phase can be extended to lower temperature, a series of Ag-alloyed Cu3-xAgxSbSe3 (x = 0, 0.1, 0.2 and 0.3) polycrystalline samples were synthesized and characterized in this work. It was found that the Ag-alloying shifts the order-disorder transition temperature to lower ones, which is beneficial to the thermoelectric application of Cu3SbSe3. For thermal transport, Ag-alloying is effective in suppressing lattice thermal conductivity in the copper-ions-ordered region, while in the copper-ions-disordered region, Ag-alloying barely has any effect on lattice thermal conductivity, as the phonon scattering is dominated by the liquid-like behavior of copper ions. Although Ag and Cu atoms have the same valence electron number, the carrier concentration is slightly increased after Ag-alloying, which suppresses the bipolar effect and increases the Seebeck coefficient at high temperatures. Finally, a maximum zT of 0.34 is obtained at 652 K for the sample Cu2.7Ag0.3SbSe3, which is 161% higher than that of the pristine sample.

Ag-alloyingCu3SbSe3Lattice thermal conductivityPhase transitionThermoelectric

Huang Y.、Fan L.、Lu X.、Zhou X.、Zhang B.、Han G.、Dai L.、Wang Z.、Huo Y.、Chen P.、Wang G.

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College of Physics and Institute of Advanced Interdisciplinary Studies Chongqing University

Analytical and Testing Center Chongqing University

College of Materials Science and Engineering Chongqing University

Chongqing Institute of Green and Intelligent Technology Chinese Academy of Sciences

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2022

Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
年,卷(期):2022.919
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