Journal of Alloys and Compounds2022,Vol.89210.DOI:10.1016/j.jallcom.2021.162141

Forming-free Pt/Al2O3/HfO2/HfAlOx/TiN memristor with controllable multilevel resistive switching and neuromorphic characteristics for artificial synapse

Ismail M. Mahata C. Kim S.
Journal of Alloys and Compounds2022,Vol.89210.DOI:10.1016/j.jallcom.2021.162141

Forming-free Pt/Al2O3/HfO2/HfAlOx/TiN memristor with controllable multilevel resistive switching and neuromorphic characteristics for artificial synapse

Ismail M. 1Mahata C. 1Kim S.1
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作者信息

  • 1. Division of Electronics and Electrical Engineering Dongguk University
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Abstract

Controllable multilevel resistive switching (RS) and neuromorphic characteristics emerges as a promising paradigm to build power-efficient computing hardware for high density data storage memory and artificial intelligence. Nevertheless, the current nonvolatile memory still endures from reliability and variability of the memristors. In this work, Pt/Al2O3/HfO2/HfAlOx/TiN multilayer memristor was prepared by using atomic layer deposition (ALD) to examine the well-regulated multilevel RS and neuromorphic properties. The memristor was found to demonstrate admirable RS properties, including forming-free, low operating voltage (Set/Reset), high switching ratio (>100), multi-level retention time (104 s), and good durability (1000 switching cycles). Furthermore, seven and four resistance states can be accomplished by modulating CC through set-operation and stop-voltage during the reset-operation. By modulating the multi-level resistance state, the electronic synapse can simulate synaptic plasticity, such as potentiation/depression, paired pulse facilitation (PPF) and spike-timing-dependent plasticity (STDP). Results show that a multilayer memristor has potential in the application of multilevel data storage memory and bionic portable electronic devices.

Key words

Electronic synapse/Multilayer memristor/Neuromorphic systems/Non-volatile memory/Wearable electronics

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量23
参考文献量73
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