Computational Materials Science2022,Vol.2076.DOI:10.1016/j.commatsci.2022.111321

Size and stoichiometric dependence of thermal conductivities of InxGa1-xN: A molecular dynamics study

Wang, Bowen Yan, Xuefei Yan, Hejin Cai, Yongqing
Computational Materials Science2022,Vol.2076.DOI:10.1016/j.commatsci.2022.111321

Size and stoichiometric dependence of thermal conductivities of InxGa1-xN: A molecular dynamics study

Wang, Bowen 1Yan, Xuefei 1Yan, Hejin 1Cai, Yongqing1
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作者信息

  • 1. Univ Macau
  • 折叠

Abstract

The thermal conductivities kappa of wurtzite InxGa1-xN are investigated using equilibrium molecular dynamics (MD) method. The kappa of InxGa1-xN rapidly declines from InN (kappa InN = 141 W/mK) or GaN (kappa GaN = 500 W/mK) to InxGa1-xN (x =/ or 1), and reaches a minimum (kappa min = 19 W/mK) when xis around 0.5 at 300 K. The mean free path (MFP) of InxGa1-xN, ranging from 2 to 5 nm and following the same trend with the kappa, is extrapolated in our simulation and a parabolic relationship between x and MFP is established. We find that the kappa of InxGa1-xN decreases with increasing temperatures. The evolution of kappa of InxGa1-xN is also examined by projecting the momentum-energy relationship of phonons from MD trajectories. The phonon dispersion and phonon density of states for InxGa1-xN reflect a slightly more flattened dispersive phononic curve of the alloying system. Despite an overestimated kappa than experimental values, our calculated kappa at 300 K agrees well with the results obtained by solving Boltzmann transport equation and also has the same stoichiometric trend with the experimental data. Our study provides the coherent analysis of the effect of thickness, temperature and stoichiometric content on the thermal transport of InxGa1-xN which is helpful for the thermal management of InxGa1-xN based devices.

Key words

Thermal conductivity/InxGa(1)-xN/Mean free path/Phonon/GALLIUM NITRIDE GAN/IRREVERSIBLE-PROCESSES

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出版年

2022
Computational Materials Science

Computational Materials Science

EISCI
ISSN:0927-0256
被引量2
参考文献量48
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