首页|(105855)Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints
(105855)Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints
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NSTL
Elsevier
In this research, cohesive parameters were extracted for Sn-0.7Cu/Cu solder joint failure. Double cantilever beam (DCB) specimens were used to study the fracture of the joint under both mode-1 and mixed-mode conditions. A bilinear traction separation law (TSL) was used to capture the failure of the joint. Increasing the bond-line thickness from 110 to 880 urn increased the critical energy release rate for crack initiation (G_(ci)) and maximum traction of the bilinear TSL. This increase in the G_(ci) was attributed to an increase in plastic zone area (PZA) ahead of the pre-crack tip. Varying the mode-mixity with phase angle (ψ) in the range of 0°-33° showed an insignificant change in G_(ci) and maximum traction of the bilinear TSL.
Lead-free solderCritical energy release rate G_cBond-line thicknessMode-mixityBilinear traction separation law
Ved Prakash Sharma、Naresh V. Datla
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Department of Mechanical Engineering, Indian Institute of Technology Delhi, India
NSTL
Elsevier
