首页|Pulsed electrodeposition of homogenous and heterogeneous solid solution layered structure in high strength nanocrystalline Co - Cu alloys

Pulsed electrodeposition of homogenous and heterogeneous solid solution layered structure in high strength nanocrystalline Co - Cu alloys

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A supersaturated solid solution nanostructure of an immiscible Co - Cu system is among the promising nanocrystalline (NC) alloys offering enhanced thermal and mechanical stability. In this paper, experiments were conducted to study the phase transformation and tailoring microstructure from a homogeneous/single-phase to a heterogeneous/dual-phase solid solution layered Co - Cu nanostructure via pulsed electrochemical deposition (PED). The increasing concentration of sodium dodecyl sulfate (SDS) in electrolyte played a crucial role in stabilizing a homogeneous solid solution Co - Cu nanostructure. On the other hand, the opposite approach led to the formation of heterogeneous solid solution Co - Cu alloys in the form of multilayered nanostructure consisting of the primary and secondary solid solution Co - Cu differing in 10-15 at.% Cu. The separation of primary and secondary phase is more prominent with the extended pulsed periods. The mechanical properties of selected single- and dual -phase alloys were investigated through micro-pillar compression, revealing that a combination of a high yield strength and an elevated strain hardening can be achieved in NC materials through a combined solid solution strengthening and hardening through nano-twin (NT).

Nanocrystalline alloysSolid solution structurePulsed depositionmicro-mechanicsMECHANICAL-PROPERTIESTHERMAL-STABILITYPHASE-SEPARATIONCOPPERCOBALTTENSILEMICROSTRUCTUREMETALS

Pratama, Killang、Tian, Chunhua、Sharma, Amit、Watroba, Maria、Gubicza, Jeno、Dilasari, Bonita、Schwiedrzik, Jakob、Michler, Johann

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EMPA Swiss Fed Labs Mat Sci & Technol

Eotvos Lorand University Department of Materials Physics

Bandung Institute of Technology Department of Metallurgical Engineering

2024

Surface & Coatings Technology

Surface & Coatings Technology

ISSN:0257-8972
年,卷(期):2024.480
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