首页|Pressure amplification and modelization in laser shock peening of Ti-6Al-4V and AA7085 with adhesive-backed opaque overlays

Pressure amplification and modelization in laser shock peening of Ti-6Al-4V and AA7085 with adhesive-backed opaque overlays

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The effects of adhesive-backed overlays, specifically vinyl tape and aluminum tape, on the peak pressures generated by laser shock peening (LSP) of 7085 aluminum alloy and Ti-6Al-4V were investigated and the results are reported. Peak pressures were determined from photon doppler velocimetry measurements of rear surface velocity. Incorporating adhesive-backed opaque overlays in LSP provided up to 50 % pressure enhancement compared to processing without the overlays. Contrary to processing without the overlays, the temporal characteristics of LSP impulses with adhesive-backed overlays are shown to be independent of the laser pulse width in the range studied. This finding is an important impulse consideration in LSP parameter selection and has not been investigated or reported in the literature. A novel physics-based analytical model to predict shockwave pressures is proposed and validated with experimental data agreeing nominally within 15 % of the predicted values across the parameter space. The results provide insight into the improved residual stresses and enhanced material properties of published opaque overlay studies. Moreover, the results provide vital information for selecting LSP parameters for optimizing component performance and potential extension into previously unreachable pressure regimes.

Laser shock peeningShockwave pressureOpaque overlaysPhoton doppler velocimetryLaser driven flyerGurney

Vivek, Anupam、Daehn, Glenn、Niezgoda, Stephen、Bovid, Stanley、Kattoura, Micheal、Clauer, Allan

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Ohio State Univ, Dept Mat Sci & Engn, Fontana Labs, 2136 140 19th Ave, Columbus, OH 43210 USA

LSP Technol Inc, 6161 Shamrock Court, Dublin, OH 43016 USA

2022

Journal of Materials Processing Technology

Journal of Materials Processing Technology

EISCI
ISSN:0924-0136
年,卷(期):2022.299
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