Journal of Alloys and Compounds2022,Vol.89412.DOI:10.1016/j.jallcom.2021.162284

Effect of equal channel angular pressing on microstructure evolution and properties variations of a CuCrZrY alloy

Xiao, Zhu Wang, Weiyang Lei, Qian Yang, Biaobiao Wang, Meng Yang, Yihai Zhou, Daren Li, Zhou
Journal of Alloys and Compounds2022,Vol.89412.DOI:10.1016/j.jallcom.2021.162284

Effect of equal channel angular pressing on microstructure evolution and properties variations of a CuCrZrY alloy

Xiao, Zhu 1Wang, Weiyang 1Lei, Qian 1Yang, Biaobiao 1Wang, Meng 1Yang, Yihai 1Zhou, Daren 1Li, Zhou1
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作者信息

  • 1. Cent South Univ
  • 折叠

Abstract

The microstructural evolutions and properties variations of a CuCrZrY alloy processed by equal channel angular pressing (ECAP) with different passes were studied systematically. After 4 passes of ECAP, the average grain size was decreased to 500 nm, and the grain size distribution became more uniform during the subsequent processing. After 8 passes ECAP-ed and aged at 400 degrees C for 7 h, the samples' tensile strength and electrical conductivity are 560 MPa and 86.4%IACS. The main strengthening mechanisms are precipitation strengthening, low-angle grain boundary strengthening, and high-angle grain boundary strengthening (about 82% in total). Finite element simulation was carried out through ABAQUS to obtain the equivalent strain distribution diagram of ECAP, resulting in that the strain force of the outer region was less than that of the inner one. The inconsistency of deformation leads to the inhomogeneity of microstructure. These findings will effectively guide researchers to develop high-strength high-electrical conductivity copper alloys. (c) 2021 Published by Elsevier B.V.

Key words

equal channel angular pressing/copper alloy/microstructure/strength/finite element simulation/CR-ZR ALLOY/HIGH ELECTRICAL-CONDUCTIVITY/MECHANICAL-PROPERTIES/PLASTIC-DEFORMATION/GRAIN-REFINEMENT/HIGH-STRENGTH/CU/ECAP/OPTIMIZATION/SIMULATION

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量5
参考文献量40
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