首页|Preparation and mechanism of Cu/GO/Cu laminated composite foils with improved thermal conductivity and mechanical property by architectural design
Preparation and mechanism of Cu/GO/Cu laminated composite foils with improved thermal conductivity and mechanical property by architectural design
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NSTL
Elsevier
? 2022 Elsevier B.V.Cu/graphene oxide(GO)/Cu laminated composite foils possessed with simultaneously high thermal and mechanical properties were prepared by a novel fabricating method, including electro-deposition, ultrasonic spraying and vacuum hot-press sintering (VHP) processing. The effect of processing parameters and laminated construction on its microstructure, morphology and properties were studied. The results showed that the C-O-Cu covalent bonding was formed at the interface between electro-deposited layers of copper and ultrasonic sprayed GO films during the fabrication process. Under the optimum process parameters, the in-plane thermal conductivity of the composites reached up to 416.7 W·m-1·k-1, meanwhile, the tensile strength of the composites was 295.1 MPa with an elongation of 20.7%, which were increased by 24.4%, comparing with pure Cu foils. The strong graphene/copper interface bonding and laminated structure were responsible for the simultaneously enhanced thermal and mechanical properties.
NSTL
Elsevier
