Journal of Alloys and Compounds2022,Vol.90413.DOI:10.1016/j.jallcom.2022.164085

Preparation and mechanism of Cu/GO/Cu laminated composite foils with improved thermal conductivity and mechanical property by architectural design

Zhan K. Li F. Wang W. Xu Y. Zhao R. Wang Z. Zhao B. Yang Z.
Journal of Alloys and Compounds2022,Vol.90413.DOI:10.1016/j.jallcom.2022.164085

Preparation and mechanism of Cu/GO/Cu laminated composite foils with improved thermal conductivity and mechanical property by architectural design

Zhan K. 1Li F. 1Wang W. 1Xu Y. 1Zhao R. 1Wang Z. 1Zhao B. 1Yang Z.2
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作者信息

  • 1. School of Materials and Chemistry University of Shanghai for Science and Technology
  • 2. School of Materials Science and Engineering Shanghai Jiao Tong University
  • 折叠

Abstract

? 2022 Elsevier B.V.Cu/graphene oxide(GO)/Cu laminated composite foils possessed with simultaneously high thermal and mechanical properties were prepared by a novel fabricating method, including electro-deposition, ultrasonic spraying and vacuum hot-press sintering (VHP) processing. The effect of processing parameters and laminated construction on its microstructure, morphology and properties were studied. The results showed that the C-O-Cu covalent bonding was formed at the interface between electro-deposited layers of copper and ultrasonic sprayed GO films during the fabrication process. Under the optimum process parameters, the in-plane thermal conductivity of the composites reached up to 416.7 W·m-1·k-1, meanwhile, the tensile strength of the composites was 295.1 MPa with an elongation of 20.7%, which were increased by 24.4%, comparing with pure Cu foils. The strong graphene/copper interface bonding and laminated structure were responsible for the simultaneously enhanced thermal and mechanical properties.

Key words

Architectural design/Cu matrix composites/Sintering/Thermal properties

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量6
参考文献量72
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