Grain boundary grooving in a polycrystalline thin film: A phase-field study
Mukherjee, Rajdip 1Abinandanan, T. A.2
扫码查看
点击上方二维码区域，可以放大扫码查看
作者信息
1. Indian Inst Technol
2. Indian Inst Sci
折叠
Abstract
Surface diffusion controlled grain boundary grooving in a polycrystalline thin film is studied using a phase-field model. We validate our model by comparing the simulation results with the classical theory of Mullins and further study the systems with anisotropic interfaces and finite grain sizes. Steady state velocity for grain growth is observed in the former case when grooving becomes extremely slow. The temporal evolution of groove depth shows significant deviation from Mullins' theory in the latter case, due to overlap of groove profiles. We also extend the model in the third dimension to study pitting at grain vertices in a thin film with equal sized hexagonal grains. The results indicate that for a given film thickness there exists a critical grain size above which hole formation occurs due to pitting.
Key words
Interface diffusion/Grain boundary migration/Thin film/Thermal grooving/Phase field model/SURFACE-DIFFUSION/MODEL/EVOLUTION/GROWTH/INSTABILITY/KINETICS
NSTL
Elsevier