首页|Intelligent detection technology of flip chip based on H-SVM algorithm
Intelligent detection technology of flip chip based on H-SVM algorithm
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NSTL
Elsevier
The Flip Chip (FC) technology has been widely used in microelectronic packaging, and the FC technology requires not only higher precision, but also higher reliability, which makes the defect detection of FC more challenging. In this paper, the SAM image of FC is segmented. Histogram of oriented gradient (HOG) as a feature extraction method and optimized support vector machines (SVM) are combined to design an intelligent diagnosis algorithm, which was called H-SVM. This method was used to realize the defect detection of solder bumps. In the same variable environment, it evaluates and compares with other machine learning algorithms. The results show that it is effective to combine HOG and optimized SVM for the diagnosis of convex defects with high detection accuracy.
NSTL
Elsevier
