首页|Analytical solution for the problem of one-dimensional quasi-steady non-charring ablation in a semi-infinite solid with temperature-dependent thermo-physical properties

Analytical solution for the problem of one-dimensional quasi-steady non-charring ablation in a semi-infinite solid with temperature-dependent thermo-physical properties

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? 2022 Elsevier LtdExact quasi-steady solution of temperature distribution for one-dimensional non-charring ablation in a semi-infinite material with temperature-dependent thermo-physical properties is obtained analytically, in which the surface temperature and the surface recession velocity are assumed to be constant. The analytical solutions for the cases in which thermo-physical properties are expressed by low degree polynomial functions of temperature are also obtained. Two kinds of non-charring ablation models are considered. One is a single phase model composed of a single phase (the crystalline phase), in which the surface recedes due to ablation. The other is a two-phase model composed of two phases (the crystalline and the amorphous phases) such as Teflon, in which the surface of the amorphous region recedes. The calculated results of the analytical solution agreed well with those of the numerical solution by the finite difference method. The basic behavior of Teflon ablation is calculated by using the analytical solution. The simple and exact analytical solution obtained in this paper is easy to calculate and is helpful in understanding the ablation behavior easily. It allows for rapid estimation of the ablation behavior for engineering purposes. The solution also provides a means to verify computer solutions obtained by numerical methods.

Analytical solutionNon-charring ablationOne-dimensional heat transferQuasi-steadySemi-infinite solidTemperature-dependent thermo-physical properties

Kato S.、Matsuda S.

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School of Engineering Faculty of Engineering University of the Ryukyus

2022

Thermal science and engineering progress

Thermal science and engineering progress

SCI
ISSN:2451-9049
年,卷(期):2022.31
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