Journal of Alloys and Compounds2022,Vol.9247.DOI:10.1016/j.jallcom.2022.166479

Spectroscopic study and thermoelectric properties of copper sulfide thin films prepared by the flash evaporation method

Elmassi S. Tchenka A. Drissi S. Abali A. El Kissani A. El Assali K. Outzourhit A. Somaily H.H. Amiri L. Narjis A. Nkhaili L. Bousseta M.
Journal of Alloys and Compounds2022,Vol.9247.DOI:10.1016/j.jallcom.2022.166479

Spectroscopic study and thermoelectric properties of copper sulfide thin films prepared by the flash evaporation method

Elmassi S. 1Tchenka A. 1Drissi S. 1Abali A. 1El Kissani A. 1El Assali K. 1Outzourhit A. 1Somaily H.H. 2Amiri L. 1Narjis A. 1Nkhaili L. 1Bousseta M.1
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作者信息

  • 1. Laboratory of Materials Energy and the Environment (LaMEE) Faculty of Science Semlalia Cadi AyyadUniversity
  • 2. Research Center for Advanced Materials Science (RCAMS) King Khalid University
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Abstract

? 2022 Elsevier B.V.Different phases of copper sulfide were synthesized by the Flash Evaporation method, followed by annealing at various temperatures. Pure and mixed crystal structures of the covellite, digenite and djurleite phases were identified by the X-ray diffraction patterns and Raman spectroscopy. Scanning Electron Microscopy revealed the effect of annealing on the surface morphology. The carrier concentration was found to decrease with increasing the annealing temperature due to the disappearance of copper vacancies. This results in an increase in the Seebeck coefficient and a decrease in the electrical conductivity. The thermoelectric power factor is better when the digenite phase dominates and doping may be a possible solution towards the integration of this material in the thermoelectric technology. Finally, annealing provided access to the Density Of States engineering, which is useful for future investigations.

Key words

Annealing/Copper sulfide/Flash Evaporation/Seebeck coefficient/Thermoelectric properties

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量9
参考文献量34
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