首页|Interfacial engineering of heterojunction copper-cobalt-nickel nitride as binder-free electrode for efficient water splitting
Interfacial engineering of heterojunction copper-cobalt-nickel nitride as binder-free electrode for efficient water splitting
扫码查看
点击上方二维码区域，可以放大扫码查看
原文链接
NSTL
Elsevier
? 2022 Elsevier B.V.Good interfacial compatibility is essential to grow intermetallic compound layer on the surface of substrates for the potential application of electrocatalytic reactions. Here, an interface strategy is proposed to prepare a free-standing copper-cobalt-nickel nitride electrode，in which copper-cobalt-nickel nitride is anchored on hydrophilic treated nickel foam. Compared to bi-metal hierarchical catalysts, the as-fabricated epitaxial heterostructure shows excellent oxygen evolution reaction (OER) activity with an ultralow overpotential of 190 mV, as well as an overpotential of 63 mV for hydrogen evolution reaction (HER) at the current density of 10 mA cm–2. Most importantly, the modified tri-metal nitrides exhibit improved interfacial compatibility due to the interfacial defects, which can increase electron transport across the junction during the catalytic reactions. Density functional theory calculations reveal that the synergistic effect between copper, cobalt, and nickel nitride creates a proper electronic structure that lowers the reaction barriers of HER/OER.
International Collaborative Laboratory of 2D Materials for Optoelectronics Science and Technology of Ministry of Education Institute of Microscale Optoelectronics Shenzhen University
School of Metallurgy and Environment Central South University
NSTL
Elsevier
