Journal of Alloys and Compounds2022,Vol.8907.DOI:10.1016/j.jallcom.2021.161897

High stability of flexible perovskite transparent conductive oxide film via van der Waals heteroepitaxy

Zhang X. Ji Y. Qian F. Fan J. Li W. Xu R. Yang H. Zhang D. Liu J. Lu J. Wang H. Zhao R.
Journal of Alloys and Compounds2022,Vol.8907.DOI:10.1016/j.jallcom.2021.161897

High stability of flexible perovskite transparent conductive oxide film via van der Waals heteroepitaxy

Zhang X. 1Ji Y. 1Qian F. 1Fan J. 1Li W. 1Xu R. 1Yang H. 1Zhang D. 2Liu J. 2Lu J. 2Wang H. 2Zhao R.3
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作者信息

  • 1. College of Science Nanjing University of Aeronautics and Astronautics
  • 2. School of Materials Engineering Purdue University
  • 3. Jiangsu Key Laboratory of Micro and Nano Heat Fluid Flow Technology and Energy Application School of Physical Science and Technology Suzhou University of Science and Technology
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Abstract

Transparent conducting oxides (TCOs), such as indium-tin oxide (ITO) and indium gallium zinc oxide (IGZO), are essential components in the design of flexible optoelectronic devices. However, it is still a challenge to prepare low-cost flexible transparent conductive film for achieving the flexible functionality together with high optical transparency and electrical conductivity. Herein, fluorphlogopite (mica) is selected as the bendable and transparent substrate for the fabrication of low-cost perovskite CaVO3 TCO epitaxial film. Benefitting from thin mica substrate with high Young's modulus of 200 GPa, flexible CaVO3 TCO epitaxial film exhibits high mechanical stability in terms of electrical conductivity and optical transparency after bending up to 105 cycles. The change of resistance can reflect the bending curvature and strain state. Our results provide a new pathway to design superior mechanical flexibility and stability CaVO3 TCO films for application in flexible, light-weight, and portable smart optoelectronic devices.

Key words

CaVO3/Epitaxial thin films/Flexible/Optoelectronic devices/Transparent conducting oxides

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出版年

2022
Journal of Alloys and Compounds

Journal of Alloys and Compounds

EISCI
ISSN:0925-8388
被引量9
参考文献量46
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