Applied thermal engineering2022,Vol.21015.DOI:10.1016/j.applthermaleng.2022.118373

Research on novel battery thermal management system coupling with shape memory PCM and molecular dynamics analysis

Wu, Tingting Wang, Changhong Zhou, Li He, Kui Hu, Yanxin
Applied thermal engineering2022,Vol.21015.DOI:10.1016/j.applthermaleng.2022.118373

Research on novel battery thermal management system coupling with shape memory PCM and molecular dynamics analysis

Wu, Tingting 1Wang, Changhong 1Zhou, Li 1He, Kui 2Hu, Yanxin1
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作者信息

  • 1. Guangdong Univ Technol
  • 2. Dongguan Univ Technol
  • 折叠

Abstract

Traditional battery thermal management using phase change materials (PCM) is restricted by PCM's leakage, low thermal conductivity and incompatibility. In this work, a shape memory composite PCM (SCPCM) composed of styrene-b-(ethylene-co-butylene)-b-styrene triblock copolymer (SEBS), paraffin (PA), expanded graphite (EG) and Fe3O4-modified graphene oxide (Fe3O4-MGO) was prepared. The thermal properties and shape stability of the composite material were studied. The compatibility between the phase change matrix and the support material was investigated. The results show that reducing the size of EG particles can effectively reduce the thermal conduction "percolation point". The Fe3O4-MGO particles loaded on EG can effectively reduce the interfacial thermal resistance between EG and PA then further strengthen the heat transfer capability of CPCM. SCPCM shows good thermal stability in the range of phase transition temperature higher than PA (49-85 degrees C). The simulation results show that PA and SEBS molecules exhibit good interfacial compatibility, hydrogen bonds are formed between the molecules where there is a strong interaction. Therefore, PA/SEBS show good thermal stability in the macro system. SCPCM exhibits excellent performance in heat dissipation. Under discharge conditions of 3C, the temperature difference in the SCPCM module is kept within 3 degrees C.

Key words

Thermal management system/Phase change material/Shape memory/Compatibility/PHASE-CHANGE MATERIAL

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出版年

2022
Applied thermal engineering

Applied thermal engineering

EISCI
ISSN:1359-4311
被引量7
参考文献量29
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