报告详细介绍了本年年度计划执行情况、项目执行过程中存在的问题及对策、2014年度工作计划与进度安排。其中详细介绍了本年度研究工作的主要进展，包括三个方面内容，即基于GaAs湿法腐蚀的圆片级封装研究、含TSV结构的GaAs圆片级封装和GaAs传感器的3D堆叠封装。This annual report introduces the works of this year’s annual plan, issues and how it was solved during the execution of the project, work plan and schedule of 2014, and the publish list of articles and patents of this year in detail. Among all of these sections, progresses of the research work during this year were detailed introduced, which include three aspects, i.e., study of wafer level packaging of GaAs image sensor based on GaAs wet etching, study of wafer level packaging of GaAs image sensor with TSV structures, and 3D stack packaging of GaAs image sensor.
罗乐、徐高卫、盖蔚、王双福、叶交托
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中国科学院上海微系统与信息技术研究所
GaAs图像传感器 系统级封装 GaAs湿法腐蚀 TSV 3D堆叠封装 GaAs image sensor System in Package GaAs wet etching TSV 3D stack package achievements and issues annual report
NSTRS
