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Key engineering materials
Trans Tech Publications Ltd.
Key engineering materials

Trans Tech Publications Ltd.

半月刊

1013-9826

Key engineering materials/Journal Key engineering materials
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    Measurement of Spindle Thermal Growth on a Machine Intended for Micro / Meso Scale Milling

    J.B. SaedonS.L. SooD.K. Aspinwall
    P.55-60页
    查看更多>>摘要：Micro milling is gaining ground as the preferred process for the manufacture of micro/meso-scale components in conventional workpiece materials, in particular for miniature moulds and tooling inserts (～ 60HRC), for the plastics injection moulding industry. Following a brief literature review on microscale milling and associated machine tool/tooling developments, experimental results are presented in relation to spindle thermal growth for a compensated/cooled spindle operating at up to 60,000 rpm, designed to accommodate the machining of meso-scale/micro-scale components. The work involved investigation of spindle warm up and cool down rates for speeds ranging from 30,000 - 60,000 rpm and subsequently the evaluation of spindle growth using both non-contact and contact measuring systems. Growth levels of up to 16um were detected despite active spindle cooling and the incorporation of a standard compensation algorithm within the control system. Modification to spindle acceleration and deceleration rates reduced error levels by up to 50%.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container

    Kei KITAMURAToshiro DOISyuhei KUROKAWAYoji UMEZAKI...
    P.61-65页
    查看更多>>摘要：We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Atomic-Scale Planarization of Single Crystal Diamond Substrates by Ultraviolet Rays Assisted Machining

    Mutsumi TOUGESatoru ANANShogo WADAAkihisa KUBOTA...
    P.66-70页
    查看更多>>摘要：The ultra-precision polishing assisted by the ultraviolet rays irradiation was performed to achieve the atomic-scale planarization of the single crystal diamond substrates. This polishing method is a novel and simple polishing method characterizing by a quartz disk and an ultraviolet irradiation device. The principle three crystal planes of the diamond substrate were polished by this method. The polished surfaces were evaluated by an optical interferometric profilers (Wyko), an atom force microscope (AFM) and LEED (low-energy electron diffraction). The surface roughness of the polished diamond substrates was evaluated as 0.2 ～ 0.4 nmRa in (100), (110) and (111) crystal planes. The LEED (low-energy electron diffraction) patterns indicated the almost perfect crystallographic structure without the residual processed strain beneath the polished surface. In this paper, the optimum polishing condition to achieve the atomic-scale planarization of the diamond substrates has been investigated by the evaluation of LEED patterns, Wyko and AFM images. The mechanismof the ultraviolet rays assisted polishing is discussed in detail.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Achieving High Flatness of Workpiece Edge Shape by Considering Polishing Pressure

    Takahiro MiyakeToshiyuki Enomoto
    P.71-75页
    查看更多>>摘要：In recent years, the achievement of further high flatness of workpiece edge shape is strongly required in mirror finishing. Especially, the edge roll off of silicon wafers as the substrates of semiconductor devices is demanded to decrease in the polishing process for raising the yield of IC chips. Many theoretical and experimental analyses for the edge roll off generation have been already done to meet the demand. The analyses, however, cannot fully account for the obtained edge shape in actual polishing. Concretely, the influence of the polishing pressure as one of the key polishing conditions on the edge roll off has not been clarified. In this study, the influence of the polishing pressure on the edge shape was investigated by the polishing experiments and the edge roll off generation analyses using the model based on the viscoelasticity of the polishing pad, which was proposed in the previous study. And it was revealed that an appropriate polishing pressure is needed to be set for achieving high flatness of workpiece edge shape with the consideration of the properties of applied polishing pads.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Microstructural Changes during Precision Machining of Thin Substrates

    K. SaptajiS. Subbiah
    P.76-80页
    查看更多>>摘要：This paper reports investigations in machining of thin substrates with thickness less than 100μm. The machining process induces severe plastic deformation through the thickness of the machined thin workpiece due to the high ratio of the depth of cut to workpiece thickness. The diamond face turning is used to machine thin workpieces down to a thickness less than 100μm. The microstructure of the machined sample is studied and x-ray diffraction used to observe the crystallographic orientation / texture. The microstructures of the thin machined workpieces are seen to become more random, denser, and finer with the shape of the grains less elongated as compare to the bulk and thick machined sample. The x-ray diffraction analyses indicate that machining of thin substrates changes the texture or orientation. Different deformation mechanisms may occur when machining thin workpiece especially at thicknesses below 100μm.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    A Feasibility Study on Laser-Mechanical Drilling of SiC Ceramics

    Chandra NathGary Ka Lai NgGnian Cher LimJeong Hoon Ko...
    P.81-85页
    查看更多>>摘要：Structural SiC (α-type) is believed to be widely applied in hostile environments such as high-temperature, high-corrosive applications in the semiconductor industries due to its superior thermo-physical and mechanical properties. However, the extremely high hardness and brittleness of SiC makes hole drilling difficult by the conventional mechanical drilling (CMD) technique. Laser can be used to drill SiC; but the resultant holes are often tapered and uneven, with tendency for microcracks and thermal damage to occur at the hole entry due to the high thermal shock from the laser. This paper reports on the experimental results of a sequential laser-mechanical drilling (LMD) technique for drilling α-SiC. At first, an Nd:YAG laser was used to drill a series of pilot holes on a 3 mm thick SiC plate. Then a diamond-coated carbide drill was sequentially applied to these holes to obtain desired hole diameter of 0.5 mm. A number of through holes on SiC (aspect ratio: 6) were successfully obtained using this approach. The quality of the drilled holes were assessed in terms of the entrance and exit sizes and conditions, hole taper angle, hole edge shapes, and microcracks. Finally, comparisons of the LMD performances were also made against the holes predrilled by the laser itself and holes of the similar size drilled separately with the CMD technique. The experiment results show that the proposed drilling approach can effectively drill α-SiCceramics.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    The Application of Nanotechnology for Mechanical Manufacturing

    Li-zhi GuQi HongChun-jiang Xiang
    P.86-90页
    查看更多>>摘要：Nanoscience and nanotechnology is one of the most important researches in the 21st century. This paper took the application of nanotechnology for mechanical manufacturing as a point of departure, discussed the nano-material technology, nano-processing technology, nano-assembly technology and nano-measurement technology in mechanical manufacturing, and described the resulting theory nano-mechanics which was different from the traditional mechanics. Moreover the important role of nano-technology for the development of mechanical manufacturing was pointed out at the end of the paper.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Forming of Microstructure on Hard Brittle Materials in Ductile Mode Cutting

    Kunitaka KuriyamaMasahiko FukutaKatsuhiko SekiyaKeiji Yamada...
    P.91-95页
    查看更多>>摘要：The requirement of the ultra-precision machine tools for ductile cutting of hard brittle materials was examined experimentally. One of the essential factors of achieving ductile mode cutting was not only high-resolution feedback control but also the dynamic performance of the machine tool in forming solid immersion lens of monocrystalline silicon. We also proposed newly developed method for ultra-precision machine tools, which does not have enough high dynamic performance in order to achieve ductile mode cutting of the hard brittle materials. An additional device consisted of air slider on the machine tool was applied to cutting of glass in order to keep stable ductile mode cutting. We fabricated high-value added structure, which are designed a diffraction grating, consisted of micro groove on a borosilicate crown glass surface with the developed device.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Improvement in Drilling Performance of Micro Compound Tool

    Osamu OhnishiHiromichi OnikuraToshihiko EguchiMuhammad Aziz...
    P.96-100页
    查看更多>>摘要：The present paper deals with the development of micro compound tools and their application to the micro drilling. The micro compound tool consists of a micro drill part and an electroplated part with a nominal finishing diameter of 100 urn and they are fabricated by grinding and electroplating processes. Fabricated tools are used in drilling tests with or without ultrasonic vibration. Influences of drill part geometry on burr formation and influences of diamond grit size on peeling of the electroplating layer are investigated. As the results, secondary cutting edges do not seem to have remarkable ability for reduction of burrs. And large size of diamond grit at the electroplated part of a micro compound tool with a small difference between a diameter of electroplated part and a diameter of drill part seems to be effective in preventing peeling of the electroplating layer and improving drilling performance.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Fabrication of a Beam Shaping Lens for Chip Scale Packaged LEDs

    Jae Young JooChang Suk KangSun Sub ParkSun-Kyu Lee...
    P.101-105页
    查看更多>>摘要：In this paper, we demonstrated the machining process of a novel Light Emitting Diodes (LED) beam shaping lens, called TIR Fresnel lens, for GaN-based blue Chip Scale Packaged (CSP) LEDs. Upon achieving a precise alignment of the tool and identifying the best manufacturing condition, we have successfully fabricated a prototype of this lens on poly methyl methacrylate (PMMA) plate. The form error of the central aspheric lens was less than 1 μm deviation, and surface quality of the Fresnel facets were sufficient for Total Internal refraction without any burr or adhesion of the machined chip. Fabricated TIR Fresnel lens reduced the viewing angle of the testing CSP LED from 140° to 17.4° in FWHM. The proposed lens produced extreme compactness as well as high collimation efficiency, thereby applicable to an ultra-thin optical system.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd