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    Researchers Submit Patent Application, 'End Effector Pad Design For Bowed Wafers ', for Approval (USPTO 20240335954)

    147-150页
    查看更多>>摘要:News editors obtained the following quote from the background information supplied by the inventors: “In semiconductor wafer processing tools, wafer handling robots with end effectors may be used to transfer substrates between different loc ations within a tool, such as processing stations, front-opening universal pods (FOUPs), aligners, load locks, etc. In some types of end effector, when a substr ate is handled by a wafer handling robot, the substrate sits on end effector pad s located on the end effector. The end effector pads may be used to secure the s ubstrate to the wafer handling robot through the use of vacuum and frictional fo rce. If the substrate is not properly secured to the wafer handling robot, the s ubstrate may slip when being transferred. A substrate slipping may create a vari ety of risks such as breaking substrates, crashing substrates, misalignment of s ubstrates in processing stations, and other tool errors.”

    Researchers Submit Patent Application, 'Container And Container Recognition Method', for Approval (USPTO 20240336431)

    150-155页
    查看更多>>摘要:News editors obtained the following quote from the background information supplied by the inventors: “A robot-based warehousing system uses an intelligent opera ting system to automatically retrieve and store goods through system instruction s. In addition, the robot-based warehousing system can operate 24 hours a day wi thout interruption, replacing manual management and operations, so that the ware housing efficiency is improved, and the robot-based warehousing system is widely applied and popular.

    Patent Issued for Three-dimensional sensing device and specular reflection object detection method (USPTO 12112492)

    155-158页
    查看更多>>摘要:Reporters obtained the following quote from the background information supplied by the inventors: “Technical Field“The disclosure generally relates to a sensing device and a detection method and, in particular, to a three-dimensional (3D) sensing device and a specular refle ction object detection method. “Description of Related Art “Recently, 3D sensing is widely applied to face recognition, simultaneous locali zation and mapping (SLAM), etc. Generally, 3D sensing can be classified into tim e-of-flight (ToF) sensing, dual camera, and structured light sensing. In the str uctured light sensing, a structured light is projected onto an object to form li ght pattern on the object, and a camera is configured to photograph the light pa ttern. By calculating the shifts of the points of the light pattern, distances b etween the points of the light pattern and the camera are obtained.