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材料科学技术（英文版）
材料科学技术（英文版）

胡壮麟

月刊

1005-0302

jmst@imr.ac.cn

024-83978208

110016

沈阳市沈河区文化路72号

材料科学技术（英文版）/Journal Journal of Materials Science & TechnologyCSCDCSTPCD北大核心EISCI
查看更多>>本刊简称《JMST》，（ISSN 1005-0302，CN 21-1315/TG）。1985年创刊。是中国科协主管，中国金属学会，中国材料研究学会和中国科学院金属研究所联合主办的国际性英文期刊，以“加强国际交流，扩大学术影响，服务经济建设”为办刊宗旨，刊登世界各国的具有创新性和较高学术水平的原始性论文，并设有物约综述、快报、简讯及国内外材料界杰出学者简介等栏目，内容包括金属材料、无机非金属材料、复合材料及有机高分子材料等。
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    Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium

    Ancang YangYaoping LuYonghua DuanMengnie Li...
    246-259页
    查看更多>>摘要：The void defect in intermetallic compounds(IMCs)layer at the joints caused by inhomogeneous atomic diffusion is one of the most important factors limiting the further development of Sn-based solders.In this work,the thermodynamic stability of IMCs(high-temperature η-Cu6Sn5 and o-Cu3Sn phases)was improved by adding small amounts of indium(In),and the IMCs layers with moderate thickness,low defect concentrations and stable interface bonding were successfully obtained.The formation order of compounds and the interfacial orientation relationships in IMCs layers,the atomic diffusion mechanism,and the growth tuning mechanism of In on η-Cu6Sn5 and Cu3Sn,after In adding,were discussed com-prehensively by combining calculations and experiments.It is the first time that the classic heteroge-neous nucleation theory and CALPHAD data were used to obtain the critical nucleus radius of η-Cu6Sn5 and Cu3Sn,and to explain in detail the main factors affecting the formation order and location of IMCs at joints during the welding process.A novel and systematic growth model about IMCs layers in the case of doping with alloying elements was proposed.The growth tuning mechanism of In doping on η-Cu6Sn5 and Cu3Sn was further clarified based on the proposed model using first-principles calculations.The growth model used in this study can provide insights into the development and design of multiele-ment Sn-based solders.
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      原文链接:
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