查看更多>>摘要：Achieving high-quality joining of silicon carbide(SiC)ceramics and Inconel 718 alloy has become a significant challenge for the brazing process,which is strongly dependent on the filler material.A novel composite interlayer consisting of high-entropy alloys(HEAs),HEA/Ni/HEA,was proposed to reduce the formation of intermetallic compounds in the brazed joints of SiC ceramics and Inconel 718 alloy.A reliable SiC/Inconel 718 brazed joint was produced at 1120℃ for 60 min.The results showed a significant reduction in the number of NiSi compounds in the brazed joint.The brazing seam structure near SiC side was filled with face-centered cubic phases with good plasticity and soft Cu-rich phases due to the high-entropy effect,which effectively suppressed the formation of intermetallic compounds.The maximum shear strength of the brazed joint reached 88 MPa,showing excellent tensile strength.The results provide a valuable basis for improving the joint quality of SiC ceramics and metals by adding high-entropy alloy fillers.
查看更多>>摘要：The drive toward miniaturization,functionalization,and environmental conservation in electronic devices has increased the demand for low-temperature solder in 3D packaging processes.The influence of Sb incorporation on the structure and properties of SnBiIn solder at an equal molar ratio is investigated.It is demonstrated that Sb incorporation facilitates the formation of SnIn phase and induces the precipitation of spherical Bi particles.Furthermore,the concentration of Sb directly affects the morphologies of both Bi and SbIn phases.The amount of Sb also directly impacts the morphologies of Bi and SbIn phases,resulting in distinct solid solution and second-phase strengthening effects.These effects consequently alter the properties of the solder.This phenomenon arises because Sb hinders atomic diffusion within the joint,leading to the formation of thin Cu6(Sn,In)5 intermetallic compounds.It can be reasonably inferred that lead-free low-temperature solders,based on high-entropy alloy multicomponent compositions and engineered via elemental modulation,show pro-mise for successful applications in electronic packaging.
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