Bonding is the key process in the semiconductor device production, it influences qualified rate and long term reliability largely. The invalidation of Au-Al bimetallic bonding often occur but can't help being used in semiconductor devices, therefore, the reliability of Au-Al bimetallic bonding is taken attention. Through the analysis of failure mechanism of Au-Al bimetallic bonding, correct design methods and process controlling means are presented, many effective results of Au-Al bimetallic bonding applied in devices and circuits are exhibited. The results show that the Au-Al bimetallic bonding deviceused below junction temperature of 150 ℃ can be applied at high reliable conditions as long as designed correctly and taken process controlling means.
key processqualified rateAu-Al bondingfailure mechanismjunction temperature
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NSTL
万方数据
维普
