Suppression Effect of Self-Heating of Power Device Chips on Moisture Invasion
To investigate the suppression effect mechanism of self-heating phenomenon of power de-vice chips on moisture invasion in high-temperature and high-humidity environments,as well as the effect on the static parameters and packaging reliability of power devices,the power devices were divided into three groups for a power cycling comparison test.The first group of devices were tested for power cy-cling directly.The second group of devices were stored in 60 ℃/85％RH environment for 1 000 h before power cycling test.The third group of devices were stored in 60 ℃/85％RH environment for 1 000 h with the chip being self-heated by conduction current to simulate actual working conditions(the chip junction temperature was 120 ℃),and then the power cycling test was carried out.The experimental results show that moisture invasion can cause the static parameters drift of power devices and shorten the power cycling life of devices.The shortening in power cycling life of the device is due to the bonding wires cor-rosion of devices caused by moisture invasion,affecting the reliability of the bonding wires.The self-heating of power device chips can suppress moisture invasion,and reduce the static parameter drift and the corrosive effects on the bonding wires of devices caused by moisture invasion.
high-temperature and high-humiditypower devicestatic parameterpower cyclingpackaging reliabilitybonding wire
万方数据
维普
