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Design strategies and insights of flexible infrared optoelectronic sensors

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Design strategies and insights of flexible infrared optoelectronic sensors
Infrared optoelectronic sensing is the core of many critical applications such as night vision,health and medication,military,space exploration,etc.Further including mechanical flexibility as a new dimension enables novel features of adaptabil-ity and conformability,promising for developing next-generation optoelectronic sensory applications toward reduced size,weight,price,power consumption,and enhanced performance(SWaP3).However,in this emerging research frontier,chal-lenges persist in simultaneously achieving high infrared response and good mechanical deformability in devices and inte-grated systems.Therefore,we perform a comprehensive review of the design strategies and insights of flexible infrared optoelec-tronic sensors,including the fundamentals of infrared photodetectors,selection of materials and device architectures,fabrica-tion techniques and design strategies,and the discussion of architectural and functional integration towards applications in wearable optoelectronics and advanced image sensing.Finally,this article offers insights into future directions to practically real-ize the ultra-high performance and smart sensors enabled by infrared-sensitive materials,covering challenges in materials devel-opment and device micro-/nanofabrication.Benchmarks for scaling these techniques across fabrication,performance,and inte-gration are presented,alongside perspectives on potential applications in medication and health,biomimetic vision,and neuro-morphic sensory systems,etc.

flexibleinfrared sensorinfrared-sensitive materialsdevice architecturesfabrication techniquesdesign strategies

Yegang Liang、Wenhao Ran、Dan Kuang、Zhuoran Wang

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School of Integrated Circuits and Electronics,Beijing Institute of Technology,Beijing 100081,China

flexible infrared sensor infrared-sensitive materials device architectures fabrication techniques design strategies

2025

半导体学报(英文版)
中国电子学会和中国科学院半导体研究所

半导体学报(英文版)

影响因子:0.36
ISSN:1674-4926
年,卷(期):2025.46(1)