首页|A smart finger patch with coupled magnetoelastic and resistive bending sensors

A smart finger patch with coupled magnetoelastic and resistive bending sensors

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In the era of Metaverse and virtual reality(VR)/augmented reality(AR),capturing finger motion and force interac-tions is crucial for immersive human-machine interfaces.This study introduces a flexible electronic skin for the index finger,addressing coupled perception of both state and process in dynamic tactile sensing.The device integrates resistive and giant magnetoelastic sensors,enabling detection of surface pressure and finger joint bending.This e-skin identifies three phases of fin-ger action:bending state,dynamic normal force and tangential force(sweeping).The system comprises resistive carbon nan-otubes(CNT)/polydimethylsiloxane(PDMS)films for bending sensing and magnetoelastic sensors(NdFeB particles,EcoFlex,and flexible coils)for pressure detection.The inward bending resistive sensor,based on self-assembled microstructures,exhibits directional specificity with a response time under 120 ms and bending sensitivity from 0° to 120°.The magnetoelastic sensors demonstrate specific responses to frequency and deformation magnitude,as well as sensitivity to surface roughness dur-ing sliding and material hardness.The system's capability is demonstrated through tactile-based bread type and condition recog-nition,achieving 92%accuracy.This intelligent patch shows broad potential in enhancing interactions across various fields,from VR/AR interfaces and medical diagnostics to smart manufacturing and industrial automation.

human machine interfaceflexible sensorwearable sensorgiant magnetoelastic effectinward bending sensor

Ziyi Dai、Mingrui Wang、Yu Wang、Zechuan Yu、Yan Li、Weidong Qin、Kai Qian

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School of Integrated Circuits,Shandong University,Jinan 250100,China

Department of Mechanical Engineering,University of Auckland,Auckland 1010,New Zealand

Department of Urology,Qilu Hospital of Shandong University,Jinan 250100,China

Shenzhen Research Institute of Shandong University,Shenzhen 518000,China

Department of Critical Care Medicine,Qilu hospital of Shandong university,Jinan 250100,China

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2025

10.1088/1674-4926/24080027

半导体学报(英文版)
中国电子学会和中国科学院半导体研究所

半导体学报(英文版)

影响因子：0.36
ISSN：1674-4926
年,卷(期)：2025.46(1)