A novel electromagnetic bandgap structure for power supply noise suppression in packages
To solve the power integrity problem caused by synchronous switching noise in a high-density integrated system in package,a novel electromagnetic bandgap structure was designed.The structure was formed by a complementary split-ring resonator unit structure and an L-bridge-like inter-unit bridging structure.The gap was etched to reduce the effective capacitance of the patch,and the bridge aspect ratio was increased to raise the effective inductance of the patch.The proposed structure was modeled and simulated using the electromagnetic full-wave simulation software HFSS.The simulation results show that with the suppression depth of-40 dB as the standard,an ultra-wide band gap of 12.9 GHz can be achieved,which is obviously better than the conventional electromagnetic bandgap structure and can better suppress the synchronous switching noise.
system in package(SiP)synchronous switching noise(SSN)power integrity(PI)electromagnetic bandgap(EBG)structure
万方数据
维普
