Preparation of a new Sn-Zn-based solder paste for aluminum soldering
A new Sn-Zn-based solder paste for aluminum soldering was developed.According to the composition characteristics of solder paste for aluminum soldering,based on Sn-Zn lead-free tin powder,the active agent,active salt,surfactant,solvent,and surfactant additives in solder paste were screened,and the components were optimized and prepared by orthogonal test.The results show that in the active agent part,the wettability of solder at 240 ℃ and 260℃ decreases with the increase of organic amine A content.In the active salt part,zinc salt and tin salt are beneficial to expand the spreading area of the solder,but adding ammonium salt is not conducive to the wetting of the solder.In the surfactant part,the experimental effect of adding OP-10 is better than that of adding oleamide.Based on the above research results,the homemade solder paste for aluminum soldering can be used to braze 1060 aluminum at low temperatures,with good welding quality,and no obvious welding defects at the interface.Besides,the solder paste for aluminum soldering has good storage stability.The results can provide theoretical and technical support for the application and development of solder paste for aluminum alloy brazing.
aluminum alloysolder paste for aluminum solderingsoldering fluxorthogonal test
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