材料与冶金学报2024,Vol.23Issue(1) :36-41,47.DOI:10.14186/j.cnki.1671-6620.2024.01.006

新型Sn-Zn系焊铝锡膏的制备

Preparation of a new Sn-Zn-based solder paste for aluminum soldering

宁馨锋 郭瑛 刘慧颖 郭天浩 马海涛
材料与冶金学报2024,Vol.23Issue(1) :36-41,47.DOI:10.14186/j.cnki.1671-6620.2024.01.006

新型Sn-Zn系焊铝锡膏的制备

Preparation of a new Sn-Zn-based solder paste for aluminum soldering

宁馨锋 1郭瑛 1刘慧颖 1郭天浩 1马海涛1
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作者信息

  • 1. 大连理工大学 材料科学与工程学院,辽宁 大连 116024
  • 折叠

摘要

研制了一种新型Sn-Zn系焊铝锡膏.根据焊铝锡膏成分组成特点,以Sn-Zn系无铅锡粉为基础,对助焊膏中活性剂、活性盐、表面活性剂和溶剂等添加剂进行筛选,通过正交试验对其组分进行优化并制备出焊铝锡膏.结果表明:活性剂部分,有机胺A质量的增加会降低钎料在240℃和260℃下的润湿性;活性盐部分,锌盐和亚锡盐有利于扩大钎料铺展面积,但添加铵盐会降低钎料的润湿性;表面活性剂部分,添加OP-10的实验效果要优于添加油酸酰胺的实验效果.基于以上研究结果自制出的焊铝锡膏可用于低温钎焊1060铝,焊接质量良好,界面处未见明显焊接缺陷,且焊铝锡膏具有良好的存储稳定性.研究结果可为铝合金钎焊用焊铝锡膏的应用和开发提供理论和技术支持.

Abstract

A new Sn-Zn-based solder paste for aluminum soldering was developed.According to the composition characteristics of solder paste for aluminum soldering,based on Sn-Zn lead-free tin powder,the active agent,active salt,surfactant,solvent,and surfactant additives in solder paste were screened,and the components were optimized and prepared by orthogonal test.The results show that in the active agent part,the wettability of solder at 240 ℃ and 260℃ decreases with the increase of organic amine A content.In the active salt part,zinc salt and tin salt are beneficial to expand the spreading area of the solder,but adding ammonium salt is not conducive to the wetting of the solder.In the surfactant part,the experimental effect of adding OP-10 is better than that of adding oleamide.Based on the above research results,the homemade solder paste for aluminum soldering can be used to braze 1060 aluminum at low temperatures,with good welding quality,and no obvious welding defects at the interface.Besides,the solder paste for aluminum soldering has good storage stability.The results can provide theoretical and technical support for the application and development of solder paste for aluminum alloy brazing.

关键词

铝合金/焊铝锡膏/助焊膏/正交试验

Key words

aluminum alloy/solder paste for aluminum soldering/soldering flux/orthogonal test

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基金项目

国家自然科学基金(51871040)

出版年

2024
材料与冶金学报
东北大学

材料与冶金学报

北大核心
影响因子:0.516
ISSN:1671-6620
参考文献量17
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