The thermal simulation analysis of the integrated miniaturized YIG-tuned band rejection fliter module is proceeded by Ansys Workbench.It shows that the temperature of some heating elements in the module is above 170 ℃ under the natural heat dissipation condition,exceeding the allowable working temperature of the components by 125 ℃,so the reliability of the module cannot be guaranteed.Therefore,a heat dissipation plate is added to the bottom of the assembly to increase the heat dissipation area and improve the heat dissipation conditions.The simulation results show that the temperature of each heating component drops greatly after adding the heat dissipation plate,and the highest temperature(118 ℃)of the heating component is the PTC in the module.The temperature of the coil,control circuit and high power triode is 99 ℃,104 ℃,and 116 ℃ respectively,lower than the allowable working temperature of the components,ensuring the reliable operation of the assembly in full temperature environment.Proper component layout and heat dissipation are important design factors of component reliability in the design of integrated miniaturized module,and the thermal simulation analysis can reduce the cost of trial production and verification of modules,shorten the research cycle and efficiency.
关键词
YIG带阻滤波器/集成小型化/热仿真/工作温度
Key words
Y1G band rejection fliter/integration miniaturization/thermal analysis/working temperature
维普
万方数据