Plasma cleaning is an effective method to improve the reliability of hybrid integrated circuit assembly.Hybrid integrated circuit mostly uses a variety of active and passive devices.For the magnetic components,the plasma is bound by the magnetic field,resulting in ion aggregation.When the radio frequency energy is too large or effective protection measures are not taken,the phenomenon of luminescence discharge is easy to occur,resulting in ablation.Starting from a case of plasma cleaning failure,the ablation phenomenon of magnetic components in the cleaning process is analyzed in detail,and the corresponding improvement measures are put forward.
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