A YIG filter-specific miniaturized driver based on low-temperature co-fired ceramic(LTCC)process is proposed to reduce the volume to 1/4 of the conventional miniaturized driver,which adopts a systematic encapsulated SIP scheme.The ceramic substrate made by LTCC process technology is the main carrier board,and the aluminum nitride substrate is the carrier board for high-power components,which realizes the miniaturization of the driver by high-density SIP integrated capacitor,resistor,and integrated circuit core.Through the analysis of substrate characteristics,calculation and simulation of heat source,and current temperature compensation,this paper effectively solves the current temperature drift of the miniaturized driver,so that the current temperature drift is less than±0.5 mA,and the influence value of the frequency and temperature drift of the driver on the YIG-tuned device(filter tuning sensitivity is 20 MHz/mA)is less than±10 MHz,which meets the miniaturization drive requirements of YIG-tuned devices.
维普
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