首页|一种基于热阻矩阵的2.5D封装芯片结温预测模型

一种基于热阻矩阵的2.5D封装芯片结温预测模型

扫码查看
原文链接
  • 万方数据
  • 维普
随着 2.5D封装芯片的封装尺寸不断减小和功率密度持续增加,芯片内部温度急剧上升.为了满足芯片散热和可靠性需求,准确预测服役过程中芯片的结温具有重要的意义.在充分考虑热耦合效应后,从 2.5D封装芯片的热阻网络拓扑结构出发,提出了一种基于热阻矩阵的 2.5D 封装芯片结温预测模型.同时,采用FloTHERM热仿真软件对该预测模型进行了验证.结果表明,在对 2.5D封装芯片施加不同功率后,该模型的计算结果和FloTHERM仿真结果相对误差小于 5%.由此说明,该模型能够高效准确地预测 2.5D封装芯片的结温.
A Junction Temperature Prediction Model for 2.5D Packaging Chip Based on Thermal Resistance Matrix
As the package size of 2.5D packaging chip continues to decrease and the power density continues to increase,the internal temperature of the chip rises sharply.In order to meet the heat dissipation and reliability requirements of the chip,it is of great significance to accurately predict the junction temperature of the chip.After fully considering the thermal coupling effect,a junction temperature prediction model of 2.5D packaging chip based on thermal resistance matrix is proposed.Meanwhile,the FloTHERM thermal simulation software is used to verify the prediction model.The results show that when different power is applied to 2.5D package chip,the relative error between the calculation results of the model and the simulation results of FloTHERM software is less than 5%,which indicates that the model can predict the junction temperature of 2.5D packaging chip efficiently and accurately.

2.5D packagingresistance matrixthermal coupling effectjunction temperature predictionfinite element analysis

刘加豪、古莉娜、陈方舟、郭小童、赵昊

展开 >

工业和信息化部电子第五研究所, 广东 广州 511370

重庆赛宝工业技术研究院有限公司, 重庆 401332

2.5D封装 热阻矩阵 热耦合效应 结温预测 有限元分析

广东省重点领域研发计划中国工信部项目中国工信部项目广州市重点区域研究发展计划工信部电子第五研究所专项

2022B07011800022021-0162-1-12021-H021-1-120210302000222Z04

2024

10.3969/j.issn.1672-5468.2024.01.012

电子产品可靠性与环境试验
工业和信息化部电子第五研究所（中国电子产品可靠性与环境试验研究所） （中国赛宝实验室）

电子产品可靠性与环境试验

影响因子：0.438
ISSN：1672-5468
年,卷(期)：2024.42(1)
  • 10