Failure Analysis of Components Dropping from Electroplating Ni/Au Pads on FPC Board
Flexible printed circuit(FPC)is widely used in various electronic products.With the miniaturization of electronic products,SMT is generally used in circuit assembly to realize electri-cal conduction and signal transmission between components.The failure of components dropping from electroplated Ni/Au pads on FCP board after SMT process is introduced.The failed samples are systematically analyzed by stereo microscope,shear test,scanning electron microscope(SEM),energy dispersive spectrometer(EDS),X-ray fluorescence thickness gauge(XRF)and other methods.It is found that the components dropping are due to poor bonding between the nick-el plating layer of the pad and the bottom copper layer,and there are obvious gaps.The poor bonding force is mainly related to improper control of the electroplating process,such as incom-plete cleaning before electroplating.
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