Study on Environmental Stress Failure of CSOP Package Components
After the CSOP device is welded to the PCB board,the problem of pin cracking is easy to occur because of mechanical vibration and temperature environment change stress.The failure phenomenon of CSOP device pin in the application verification stage is analyzed.The results show that the reliability of CSOP and CQFP surface mount package device pin can be significantly improved and the device can meet the requirements of high temperature and mechanical stress by secondary pin forming,increasing the height of the pin and improving the ability of the pin to release temperature shock and vibration stress.
万方数据
维普
