Failure Analysis of MPD Chip after High Temperature Burn-in Test
The failure of MPD chip of laser during high temperature burn-in reliability test of optical module is analyzed.Firstly,the failure cause of MPD chip of laser is analyzed by means of PIV tester,high power microscope and scanning electron microscope.The results show that the reason for the failure of the chip is that silver migration occurs during the high-temperature burn-in process of the conductive adhesive,and conductive path is gradually formed between the positive and negative electrodes of the chip,which leads to thermal breakdown of the PN junction of the MPD in the failed device,and then the whole chip burns.Next,the mechanism of silver migration is analyzed.Finally,improvement measures are proposed from three aspects,such as process control,product testing and equipment debugging,which has important reference value for reducing the risk of such failure phenomenon and improving the reliability of MPD chip packaging.
monitor photodiodehigh temperature burn-insilver migrationdendrite growth
NETL
NSTL
万方数据
维普
