Finite Element Analysis of the Process Parameters of Laser Soldering Ball
As a new type of process,the laser ball implantation process is widely used in the fields of machinery,aerospace and shipbuilding.However,due to the unstable welding quality and poor consistency of welded joints,it is necessary to continuously adjust the process parameters and improve the process method.The finite element method is used for applying the rotating Gaussian volume heat source to the solder ball model,and the transient thermal analysis and static analysis are carried out to study the effect of laser height,laser power and action time on the reliability of the solder joints of Sn63Pb37 solder ball on the Au/Ni/Cu pad during the laser implantation process.The orthogonal test is used to simplify the test process,and the signal-to-noise ratio is introduced to analyze the test data.The result shows that the laser action time has the most significant effect on the temperature field and stress field of the solder joint.At the same time,the optimal design scheme of three factors is obtained.It is expected to provide some theoretical support for the improvement and optimization of the laser ball implantation process.
BGAlaser soldering ballfinite element methodheat source modelstress field
NETL
NSTL
万方数据
维普
