Study on Corrosion Behavior and Mechanism of Tin Plated Pins under Pressure Cooker Test
Chemical corrosion of pin metal coating is a typical packaging defect,which usually occurs under high temperature,high pressure and high humidity conditions,and has a serious impact on the reliability and service life of poduct. In order to study the corrosion of tin plated pins under pressure cooker test,the chemical migration of tin plated pins under pressure cooker test is studied by metallographic analysis,scanning electron microscopy analysis,X-ray photoelectron spectroscopy and other analysis methods. The results show that the main reason of chemical migration is the electrochemical reaction of tin-copper-thin liquid film formation,and the surface roughness of tin coating will aggravate the formation of corrosion. The corrosponding improvement measures are put forward,which has important reference significance for improving the corrosion resistance of the coating.
electrochemical migrationtinning plated pincorrosionpressure cooker test
万方数据
维普
