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专利视角下车规芯片可靠性技术的发展研究

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为探究我国车规芯片可靠性检测、评价、应用验证等可靠性技术的发展过程及未来趋势,更全面地了解车规芯片可靠性检测技术的专利布局和未来技术发展方向,通过Incopat专利检索和分析系统对全球可靠性技术专利进行检索,并对检索的专利在申请趋势、技术领域、技术构成功效和申请人4个维度上进行分析研究.检索结果表明,车规可靠性技术专利申请量在持续上涨,主要申请国家为中、韩、日、美、德等国家,技术领域主要分布在G部(物理)、H部(电学)和B部(作业;运输).进而针对我国在可靠性技术专利申请的现状,从芯片检测试验项目的维度提供了专利布局的建议.
Research on the Development of Reliability Technology for Automotive-grade Chip from Patent Perspective
In order to explore the development process and future trends of reliability technologies such as reliability testing,evaluation,and application verification of automotive-grade chip in China,and to more comprehensively understand the patent layout and future technological development direction of automotive-grade chip reliability testing technology,the Incopat patent search and analysis system is used to search for global reliability technology patents,and the retrieved patents are analyzed and studied in the four dimensions of application trends,technical fields,technical composition and efficacy,and applicants. The search results show that the number of patent applications for vehicle regulation reliability technology continues to rise,and the main application countries are China,South Korea,Japan,the United States,Germany,and the technical fields are mainly distributed in the G (physics),H (electricity) and B ( operation,transportation) . Furthermore,in response to the current situation of reliability technology patent applications in China,suggestions for patent layout are provided from the perspective of chip detection and testing projects.

patentautomotive-grade chipreliability technologytest technology

张秋镇、罗军、庞水全、王之哲

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工业和信息化部电子第五研究所,广东 广州 511370

电子元器件可靠性物理及其应用技术重点实验室,广东 广州 511370

专利 车规芯片 可靠性技术 检测技术

2024

电子产品可靠性与环境试验
工业和信息化部电子第五研究所(中国电子产品可靠性与环境试验研究所) (中国赛宝实验室)

电子产品可靠性与环境试验

影响因子:0.438
ISSN:1672-5468
年,卷(期):2024.42(5)